Laser Cutting Special Applications
Today, laser cutting special applications is very affordable and turnaround time is fast. Laser cutting width can be extremely small and extremely precise with laser cutting beam about 40 micron. This accuracy is very useful for cutting semi-conductor products like silicon wafers, surgical tools and the jagged teeth used in some cutting tools. Laser cutting or scribbling of silicon wafers is possible in all sizes and thicknesses with skillful Laser Application Engineering.
At ABC Laser Engraving, we process both short run and large full production cycles. There is no job is to large or small. Whether you are interested individuals or large companies, we treat you the same way, providing highest quality and value to our customer’s products. If you are interested in laser cutting service, let’s us know by calling 720-389-8954 or complete the contact form link below.
For more details call or Click here for online form